JPH0320450U - - Google Patents
Info
- Publication number
- JPH0320450U JPH0320450U JP8079189U JP8079189U JPH0320450U JP H0320450 U JPH0320450 U JP H0320450U JP 8079189 U JP8079189 U JP 8079189U JP 8079189 U JP8079189 U JP 8079189U JP H0320450 U JPH0320450 U JP H0320450U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- ground pattern
- chip mounting
- insulating substrate
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8079189U JPH0320450U (en]) | 1989-07-11 | 1989-07-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8079189U JPH0320450U (en]) | 1989-07-11 | 1989-07-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0320450U true JPH0320450U (en]) | 1991-02-28 |
Family
ID=31626155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8079189U Pending JPH0320450U (en]) | 1989-07-11 | 1989-07-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0320450U (en]) |
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1989
- 1989-07-11 JP JP8079189U patent/JPH0320450U/ja active Pending